Training & Troubleshooting Workshop Outline
The Workshop’s content and depth are designed for your company’s immediate and long-term improvements in wave solder quality.
During your Wave Solder Training & Troubleshooting Workshop, your team will apply special principles and techniques to your own boards on your own wave machines. Our expert trainer and proprietary curriculum will show you how to:
- Respond to each of the 12 key data points of wave soldering
- Eliminate bridges, insufficients, shorts, skips, pinholes, solder balls and icicles
- Quickly identify the exact causes of your defects
- Know if your defects are caused by your process, design or materials
- Overcome design errors to assemble high quality boards
- Easily use daily process data to eliminate and prevent defects
- Adjust your wave machines to achieve immediate quality improvements
- Enjoy a smooth, stable lead free process
- Successfully employ your Wave Optimizers’ special methods to quickly lower costs.
DAY 1 – At your wave machine and in classroom
A New Perspective On Your Process
- Introduction to the Solder Bond – Solder Joint Formation, Wetting
- Materials – Solder, Flux, Boards, Components
- Instrumentation – Fluxer, Air Knife, Conveyor, Preheaters, Solder Pot, Nozzle
- Board-Wave Interaction – Parallelism, Dwell Time and Immersion Depth, presentation includes copyrighted drawings
- The Relationship Between Your Wave Machine Settings and Board-Wave Interaction – Review of wave machine settings as compared to board-wave, fluxer and temp data
- How to Ensure that Your Boards are Parallel to Your Wave, including “The Secret Technique of Marking Your Fingers” demonstration of all procedures
The Simple Chemistry Factors That Make A Good Solder Joint
- Solder Bond Formation I – How your solder bond is formed at first contact with your wave, in your wave and exiting your wave
- Solder Bond Formation Il – How your molten solder penetrates the base metal
- Flux – Roles of flux, acidity and pH level, types of fluxes, in-depth analysis of your activation points and breakdown temperature, verifying thorough and even flux distribution, measuring and controlling your weight of flux applied
- Wetting Force – Angle of wetting, solder fill
- Solder Temp – Relationship of tin to lead as your solder temperature changes
DAY 2 – At your wave machine and in classroom
How to REALLY Achieve World Class Wave Solder Results
- Measuring the 12 Key Data Points of Wave Soldering and Identifying the Exact Variables of the Wave Solder Process
- Recent Studies on Wave Solder Process Control – Review of published experiments, proven methodologies and results attained in production
Your PCBs Experience In The Wave Machine
- How to Integrate Your Variables – What happens when your boards pass through the wave machine at each phase of its functioning
- Why Temperature Control is So Easy – Preheat temp, preheat slope, maximum temp, delta T, top-side and bottom-side, solder wave temperature, the broad and forgiving temperature windows, daily temperature verification
Lead Free: Basic Principles and Critical Issues
- Temperature Ranges
- Machine Issues
- Process Update
- Lead Free Defects – How to cure them; how to prevent them.
Hands-On Experiments For Superior Board Quality
- The Flow of the Solder Wave l – Solder wave flows, pulsations and variations
- The Flow of the Solder Wave ll – How your solder is pumped through the nozzle with its three characteristics: malleability, elasticity and hardness
- The Flow of the Solder Wave llI – The qualities of flow, viscosity and velocity
- Parallelism – Full Implementation of “The Secret Technique of Marking Your Fingers”; roles of conveyor, solder pot, nozzle, dross deceptions, backplate
- Immersion Depth – Relationship to contact length, relationship to dwell time, how to determine and achieve repeatability
- Dwell Time – Definition, relationship to contact length, relationship to immersion depth, relationship to wave shape, optimization by board type
- Optimizing Your Wave Solder Process to Measure and Control Repeatability and to Identify and Maintain Optimal Parameters For Each Board Type – Provocation of defects, performance of fast responses to wave solder process measurements
DAY 3 – At your wave machine and in classroom
Wave Solder Process Knowledge Assessment and Learning Test
- Comprehensive, Interactive Review of Key Workshop Highlights, including the key data points and supporting parameters for process optimization
- Detailed Analysis of High Impact Daily Procedures
- Helpful Breakdown of Unique Methods to Eliminate Board Defects
- Thorough Review of Special Techniques to Quickly Lower Production Costs
- Further Illustrations – using your own boards running through your wave machines
DAYS 4 and 5 – With individual staff members at your wave machines and in conference
Single-Minded Focus on Solving Your Specific Board Defects and Wave Machine Issues
- Active, expert, on-site troubleshooting to solve your specific wave solder challenges that were not remedied during group instruction.
- Working directly with a manager and engineer designated by you, on a one-on-one basis, to punch through your current barriers, cure your defects, and show you how to keep it that way.
- All factors will be considered: Process, equipment, chemistry, materials and design.
- We will communicate with you in advance, to set priorities for this very special day of your workshop. This includes identifying which board types and wave machines are at issue and characterizing the nature of your current concerns.
- Once your issues have been addressed, you will be provided with clear procedures to prevent their recurrence.
Schedule now to reserve the earliest date that is best for you.